Probe Card Analysis
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Application Overview: The ongoing evolution of semiconductor devices continues to result in smaller, more complex semiconductor chips. This constant trend of miniturization and optimization results in smaller and more powerful finished electronic products like computers and cell phones. However this progression ultimately presents different and complex challenges to manufacturers. A critical step in semiconductor manufacturing is the testing of individual die prior to and after packaging. This process involves the use of complex equipment to make electrical contact with the individual die to confirm their function prior to further processing. This process is generally referred to as probing. Functional testing of die uses different types of wafer probe interface devices (probe cards) to make positive contact with the die terminal pads. Decreasing bpnd pad pitch is driving the semiconductor manufacturing industry to implement the next generation of probing technology, the MEMS probe card. MEMS probe cards allow semiconductor manufacturers to meet the challenges of decreasing chip geometries. |
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Costs and Longevity for Users As with any new technology, lower initial volumes and new manufacturing techniques generally result in higher purchase costs. This is true with MEMS probe cards. Currently, MEMS probe cards are significantly more expensive than traditional needle or cantilever type cards, yet they often provide fewer device touchdowns. The high costs of these devices require end users to properly clean, maintain and diagnose problems to extend the life of the probe cards. Our technology allows for high resolution imaging of individual tips, so that when a problem tip is suspected, it can quickly and easily be examined to evaluate it's status. This allows operators to act quickly and prevent damaged probe cards and/or damaged product, ultimately providing almost immediate ROI. |
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Advanced Confocal Microscopy for MEMS probe card manufacturers Our Advanced Confocal Technology is the ideal choice for precisely monitoring many key steps in the MEMS probe card manufacturing process. Working with industry partners, we have identified several key applications where our systems provide operators and techniciand the immediate feedback required to closely monitor and control the MEMS probe card production process. Several inspections that would typically require SEM analysis can be done optically, which improves analysis efficiency. Our automation capabilities allow for fully automated inspection and analysis, which makes it an ideal choice for high production environments. Our ability to analyze thick photoresist layers aids significantly in detecting and preventing de-laminating and other process problems. Immediate Advantages: |
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